Lub tshuab nqus tsev txheej tshuab, luv luv li PVD, yog cov txheej txheem uas siv lub cev txoj hauv kev kom vaporize saum npoo ntawm cov khoom siv rau hauv atoms, molecules, lossis ions nyob rau hauv lub tshuab nqus tsev, thiab tso cov yeeb yaj kiab nyias nrog qee qhov tshwj xeeb ua haujlwm ntawm lub substrate nto. Cov txheej txheem thev naus laus zis ntawm cov cuab yeej siv tshuab nqus tsev yog muab faib ua peb pawg: vapor deposition, sputtering, thiab ion plating. Muaj peb hom evaporation txheej tshuab: tsis kam evaporation, electron beam evaporation, thiab induction cua sov evaporation.
Muaj peb lub ntsiab lus qhia rau txheej txheej tshuab hauv cov khoom siv nqus tsev: evaporation txheej tshuab, ion txheej tshuab, thiab cov cuab yeej magnetron sputtering txheej. Txhua txheej txheej txheej txheem muaj nws qhov zoo thiab qhov tsis zoo, thiab cov txheej txheem sib txawv thiab cov hom phiaj yog coated nrog cov txheej txheem sib txawv.
Resistance evaporation txheej tshuab txais cov txheej txheem evaporation txheej txheem ntawm kev tiv thaiv cua sov evaporation qhov chaw, uas feem ntau yog siv rau evaporating tsawg melting point ntaub ntawv xws li txhuas, kub, nyiaj, zinc sulfide, magnesium fluoride, chromium trioxide, thiab lwm yam; Cov cua kub resistors feem ntau yog ua los ntawm tungsten, molybdenum, tantalum, thiab lwm yam. Cov yam ntxwv tshwj xeeb, cov qauv yooj yim, thiab tus nqi qis. Disadvantage: Cov khoom yog nquag hnov mob nrog lub crucible, cuam tshuam rau purity ntawm nyias zaj duab xis, thiab tsis tuaj yeem evaporate siab melting point dielectric nyias films; Tsawg evaporation tus nqi.
Resistance evaporation plating electron beam evaporation yog ib qho cuab yeej siv high-speed electron beam cua sov kom vaporize thiab evaporate cov ntaub ntawv, thiab ces condenses rau hauv ib zaj duab xis ntawm ib tug substrate. Lub zog ntom ntom ntawm cov hluav taws xob hluav taws xob hluav taws xob tuaj yeem ncav cuag 104-109w / cm2, thiab tuaj yeem ncav cuag 3000 degree. Nws tuaj yeem evaporate siab melting point hlau los yog cov khoom siv dielectric xws li tungsten, molybdenum, germanium, SiO2, AL2O3, thiab lwm yam.
Lub hauv paus ntsiab lus ntawm electron beam evaporation yog hais tias nyob rau hauv ib tug high-lub tshuab nqus tsev ib puag ncig, high-zog electrons emitted los ntawm ib tug electron phom foob rau saum npoo ntawm lub hom phiaj cov khoom nyob rau hauv qhov kev txiav txim ntawm hluav taws xob thiab sib nqus teb, converting kinetic zog rau thermal zog. Lub hom phiaj cov khoom heats li, ua molten, los yog ncaj qha evaporates, depositing ib tug nyias zaj duab xis rau ntawm lub substrate nto.
Muaj ob hom vapor deposition qhov chaw rau hluav taws xob hluav taws xob hluav taws xob: rab phom ncaj hluav taws xob thiab e-hom phom phom (kuj ncig). Cov kab hluav taws xob hluav taws xob yog tawm los ntawm qhov chaw thiab tsom thiab deflected los ntawm lub tshuab magnetic teb rau bombard thiab cua sov cov khoom siv zaj duab xis. Nws qhov zoo muaj xws li muaj peev xwm evaporate txhua yam khoom, siab purity ntawm zaj duab xis, ua ncaj qha rau ntawm qhov chaw ntawm cov khoom, thiab siab thermal efficiency. Qhov tsis zoo ntawm cov phom hluav taws xob muaj xws li cov qauv tsim, tus nqi siab, yooj yim decomposition ntawm cov tebchaw thaum lub sij hawm deposition, thiab tshuaj tsis txaus.
Induction cua sov evaporation yog ib qho cuab yeej siv high-frequency electromagnetic teb induction cua sov kom vaporize thiab evaporate cov ntaub ntawv, condensing lawv mus rau hauv ib zaj duab xis ntawm ib tug substrate. Nws cov txiaj ntsig suav nrog tus nqi evaporation siab, uas tuaj yeem ua tau li 10 npaug siab dua li ntawm qhov chaw tiv thaiv evaporation. Qhov kub ntawm qhov chaw evaporation yog qhov ruaj khov, ua rau nws tsis tshua muaj kev sib tsoo. Lub crucible kub yog tsawg, thiab cov khoom crucible muaj tsawg fouling membrane. Nws qhov tsis zoo suav nrog qhov xav tau los tiv thaiv cov cuab yeej evaporation, tus nqi siab, thiab cov khoom siv nyuaj.
Txawm hais tias lub hauv paus ntsiab lus ntawm peb cov txheej txheem evaporation txheej thev naus laus zis rau cov khoom siv tshuab nqus tsev yog tib yam, lawv txhua tus siv cov evaporation kub kom vaporize cov ntaub ntawv rau txheej. Txawm li cas los xij, ib puag ncig uas lawv tau thov yog txawv, thiab cov ntaub ntawv txheej thiab cov substrates kuj muaj qhov sib txawv.
High zaus induction cua sov evaporation yog txheej txheem ntawm muab lub crucible uas muaj txheej txheej nyob rau hauv nruab nrab ntawm ib tug high-frequency kauv kauj, ua rau cov txheej txheem tsim muaj zog eddy tam sim no thiab hysteresis cuam tshuam nyob rau hauv lub induction ntawm high-frequency electromagnetic teb, ua nyob rau hauv cov cua kub ntawm cov zaj duab xis txheej kom txog thaum nws vaporizes thiab evaporates. Lub evaporation qhov chaw feem ntau muaj cov dej-txias high-frequency coil thiab graphite lossis ceramic (magnesium oxide, aluminium oxide, boron oxide, thiab lwm yam) crucible. Cov khoom siv hluav taws xob ntau zaus siv ntau zaus ntawm 10000 mus rau ob peb puas txhiab hertz, nrog lub zog nkag ntawm ntau mus rau ntau pua kilowatts. Qhov me me ntawm cov khoom siv membrane ntim, qhov siab dua qhov induction zaus. Induction coil zaus feem ntau yog tsim los ntawm cov kav dej txias tooj liab. Qhov tsis zoo ntawm high-frequency induction cua sov evaporation txoj kev yog tias nws tsis yooj yim rau kev kho lub zog input. Nws muaj qhov zoo hauv qab no:
1. High evaporation tus nqi:
2. Qhov kub ntawm cov evaporation qhov chaw yog ib yam thiab ruaj khov, thiab nws tsis yooj yim los tsim splashing ntawm plating droplets
3. Ib lub sij hawm thauj khoom ntawm evaporation qhov chaw, kev tswj qhov kub thiab txias yog qhov yooj yim, thiab kev ua haujlwm yooj yim.
Qhov zoo ntawm magnetron sputtering txheej tshuab yog raws li nram no
1. Siab sedimentation tus nqi. Vim yog kev siv cov hlau nplaum hluav taws xob ceev ceev, qhov loj ion tam sim no tuaj yeem tau txais, txhim kho tus nqi deposition thiab sputtering tus nqi ntawm cov txheej txheem txheej no. Piv nrog rau lwm cov txheej txheem sputtering txheej txheem, magnetron sputtering muaj peev xwm ntau lawm thiab tso zis, thiab yog dav siv nyob rau hauv ntau yam industrial productions.
2. Lub zog ua haujlwm siab. Magnetron sputtering lub hom phiaj feem ntau xaiv qhov hluav taws xob nyob rau hauv thaj tsam ntawm 200V-1000V, feem ntau yog 600V, vim tias qhov hluav taws xob ntawm 600V tsuas yog nyob rau hauv qhov ua tau zoo tshaj plaws ntawm kev siv hluav taws xob.
Tsawg sputtering zog. Qhov tsis tshua muaj hluav taws xob siv rau lub hom phiaj magnetron thiab magnetic teb kaw cov ntshav nyob ze ntawm cathode, uas tuaj yeem tiv thaiv cov khoom siv hluav taws xob ntau los ntawm qhov xwm txheej ntawm lub substrate.
3. Lub substrate kub yog tsawg. Cov hluav taws xob tsim tawm thaum lub sij hawm anodic tawm tuaj yeem siv yam tsis tas yuav tsum muaj kev txhawb nqa substrate, uas tuaj yeem txo cov hluav taws xob tawg ntawm lub substrate. Yog li ntawd, qhov kub ntawm lub substrate kuj tsis tshua muaj, ua rau nws zoo heev rau txheej ib co yas substrates uas tsis heev resistant rau high kub.
Tsis sib npaug etching ntawm qhov chaw ntawm magnetron sputtering lub hom phiaj. Qhov sib txawv ntawm qhov sib txawv ntawm cov phiaj xwm magnetron sputtering yog tshwm sim los ntawm lub hom phiaj sib nqus tsis sib xws, ua rau muaj kev sib nqus ntau dua ntawm cov chaw hauv zos ntawm lub hom phiaj thiab kev siv qis dua ntawm cov khoom siv (tsuas yog 20% -30% kev siv tus nqi)) . Yog li ntawd, txhawm rau txhawm rau txhim kho kev siv cov khoom siv ntawm lub hom phiaj, nws yog ib qho tsim nyog yuav tsum tau hloov cov khoom sib nqus sib nqus los ntawm qee txoj kev, los yog siv cov hlau nplaum txav mus rau hauv cathode, uas tuaj yeem txhim kho qhov kev siv ntawm cov khoom siv.
4. Composite phiaj. Composite phiaj coated alloy films tuaj yeem tsim. Tam sim no, Ta Ti alloy, (Tb Dy) - Fe, thiab Gb Co alloy cov yeeb yaj kiab tau ua tiav tiav siv cov khoom sib xyaw magnetron sputtering technology. Muaj plaub hom qauv rau cov hom phiaj sib xyaw, xws li cov phiaj xwm sib txuas, cov phiaj xwm square embedded, cov phiaj xwm me me, thiab cov phiaj xwm kiv cua. Ntawm lawv, cov kiv cua-zoo li cov duab kos lub hom phiaj muaj kev siv zoo tshaj plaws.
5. Kev siv ntau yam. Cov txheej txheem magnetron sputtering tuaj yeem tso ntau lub ntsiab lus, suav nrog Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta, Ti, Zr, SiO, AlO, GaAs, U, W, SnO, etc.
Lub tshuab nqus tsev ion txheej tshuab
Lub tshuab nqus tsev ion plating tshuab(abbreviated li ion plating) yog thawj zaug tsim los ntawm D M. Mattox tau thov thiab muab tso rau hauv kev xyaum nyob rau hauv 1963 raws li ib tug txheej technology uas combines evaporation thiab sputtering. Nws yog raws li ion bombardment, uas heats cov coated khoom los yog workpiece mus rau ib tug molten lub xeev, thiab siv high-zog ion bombardment rau tso chemically deposited hlau los yog semiconductor nyias zaj duab xis mus rau lub substrate nto, yog li tau txais nyias zaj duab xis nrog cov qauv tshwj xeeb thiab cov khoom.
Cov txheej txheem ntawm ion plating yog txuas cov evaporation qhov chaw rau anode thiab workpiece rau cathode. Thaum lub high-voltage direct tam sim no ntawm peb mus rau tsib txhiab volts yog siv, arc tawm yog generated ntawm lub evaporation qhov chaw thiab lub workpiece. Vim lub inert argon roj ntim rau hauv lub tshuab nqus tsev hood, qee qhov ntawm cov roj argon yog ionized nyob rau hauv qhov kev txiav txim ntawm qhov hluav taws xob tawm, tsim ib lub plasma tsaus cheeb tsam nyob ib ncig ntawm lub cathode workpiece. Qhov zoo them argon ions tau nyiam los ntawm qhov tsis zoo ntawm qhov hluav taws xob siab ntawm cathode thiab ua phem rau ntawm qhov chaw ntawm qhov chaw ua haujlwm, ua rau cov khoom thiab cov av ntawm qhov chaw ntawm lub workpiece raug txaws thiab pov tseg, yog li tso cai rau saum npoo ntawm lub workpiece. tag nrho ntxuav los ntawm ion bombardment. Tom qab ntawd, cov khoom siv hluav taws xob AC ntawm qhov chaw evaporation txuas nrog, thiab cov khoom siv evaporated yog yaj thiab evaporate, nkag mus rau thaj chaw ci ntsa iab thiab raug ionized. Cov khoom zoo evaporated ions, nyiam los ntawm cathode, maj mus rau lub workpiece nrog rau argon ions. Thaum tus nqi ntawm cov khoom evaporated ions tso rau ntawm qhov chaw ntawm lub workpiece ntau tshaj li cov ions splashed, lawv maj mam sib sau ua ib tug ruaj khov txheej txheej ntawm lub workpiece.
Cov txheej txheem txheej ntawm ion plating yog ntom, tsis muaj pinholes, npuas, thiab cov tuab tuab. Txoj kev no yog qhov tsim nyog rau txheej txheej nrog cov qhov hauv, zawj, thiab qhov khoob khoob uas nyuaj rau txheej txheej los ntawm lwm txoj kev, thiab tsis tsim cov hlau nodules. Vim nws lub peev xwm los kho cov kab nrib pleb me me thiab qhov tsis xws li pitting ntawm qhov chaw ua haujlwm, cov txheej txheem no tuaj yeem txhim kho qhov zoo ntawm qhov chaw thiab lub cev thiab cov khoom siv ntawm cov khoom coated. Kev ntsuam xyuas qaug zog tau pom tias yog tias ua haujlwm zoo, lub neej qaug zog ntawm cov khoom ua haujlwm tuaj yeem nce los ntawm 20% mus rau 30% piv rau ua ntej plating.
Cov yam ntxwv ntawm Nqus Ion Txheej
Piv nrog rau evaporation thiab sputtering, ion plating muaj cov yam ntxwv hauv qab no:
(1) Kev ua tau zoo adhesion ntawm txheej
Thaum lub tshuab nqus tsev zoo tib yam txheej, yuav luag tsis muaj kev hloov pauv txheej txuas ntawm qhov chaw ua haujlwm thiab txheej txheej. Thaum lub sij hawm ion plating, thaum ions bombard lub workpiece ntawm kev kub ceev, lawv muaj peev xwm nkag mus rau saum npoo ntawm lub workpiece thiab tsim ib tug diffusion txheej tob implanted rau hauv lub substrate. Lub interface diffusion qhov tob ntawm ion plating tuaj yeem ncav cuag plaub mus rau tsib micrometers. Nyob rau theem pib ntawm txheej, sputtering thiab deposition coexist, thiab ib tug kev hloov txheej txheej los yog ib tug sib tov txheej ntawm zaj duab xis thiab substrate Cheebtsam yuav tsim nyob rau hauv lub interface ntawm zaj duab xis thiab substrate, hu ua ib tug pseudo diffusion txheej, uas yuav ua tau zoo txhim kho cov adhesion kev ua tau zoo. ntawm txheej zaj duab xis.
(2) Muaj peev xwm plating
Thaum lub sij hawm ion plating, cov khoom evaporated cov khoom txav mus raws cov kev taw qhia ntawm hluav taws xob teb nyob rau hauv daim ntawv ntawm ions them. Yog li ntawd, txhua qhov chaw uas muaj hluav taws xob tam sim no, cov txheej txheem zoo tuaj yeem tau txais, uas yog qhov zoo dua li cov txheej txheem nqus tsev uas tuaj yeem tau txais cov txheej txheem ncaj qha. Yog li, txoj kev no yog qhov tsim nyog rau cov cheeb tsam ntawm cov khoom plated uas nyuaj rau cov phaj los ntawm lwm txoj hauv kev, xws li lub qhov hauv, qhov zawj, thiab qhov khoob khoob.
(3) Cov txheej txheem zoo
Cov txheej txheej ntawm ion plating muaj cov qauv ntom ntom, tsis muaj pinholes, tsis muaj npuas, thiab cov tuab tuab. Txawm tias cov npoo thiab grooves tuaj yeem ua tau zoo sib xws, thiab cov khoom xws li cov xov kuj tuaj yeem coated nrog cov hardness siab, hnav tsis kam (tsis tshua muaj kev sib txhuam coefficient), zoo corrosion kuj, thiab tshuaj stability, uas ua rau lub neej ntev ntawm cov zaj duab xis txheej; Nyob rau tib lub sijhawm, txheej zaj duab xis tuaj yeem txhim kho qhov tsos thiab kho kom zoo nkauj ntawm lub workpiece.
(4) Ua kom yooj yim rau kev ntxuav
Feem ntau cov txheej txheem txheej uas twb muaj lawm yuav tsum tau ua kom huv si nruj ntawm lub workpiece ua ntej, thiab cov txheej txheem yog lub luag haujlwm. Thaum lub sij hawm ion plating txheej txheem, ib tug loj tus naj npawb ntawm high-zog hais lus generated los ntawm glow paug yog siv los tsim ib tug cathodic sputtering nyhuv rau ntawm qhov chaw, uas ntxuav cov pa roj thiab roj adsorbed ntawm lub substrate nto los ntawm sputtering, purifying lub substrate nto mus txog rau thaum lub ion plating txheej txheem. tag nrho cov txheej txheem txheej tiav, ua kom yooj yim ntau ntawm kev ua ntej plating tu ua haujlwm.
(5) Cov ntaub ntawv plated muaj dav
Ion plating yog cov txheej txheem ntawm kev siv lub zog ions los ua rau lub ntsej muag ntawm lub workpiece, hloov cov hluav taws xob ntau ntau rau hauv thermal zog ntawm qhov chaw ua haujlwm, yog li txhawb kev nthuav dav thiab tshuaj lom neeg hauv cov ntaub so ntswg, thiab cov khoom ua haujlwm. tsis cuam tshuam los ntawm qhov kub thiab txias. Yog li ntawd, txheej txheem txheej txheej no muaj ntau yam kev siv thiab tsis tshua muaj kev txwv. Feem ntau, ntau yam hlau, alloys, nrog rau qee yam khoom siv hluavtaws, cov ntaub ntawv rwb thaiv tsev, cov ntaub ntawv thermosensitive, thiab cov ntaub ntawv siab melting point tuaj yeem plated. Hlau workpieces tuaj yeem plated nrog tsis yog hlau lossis hlau, nrog rau cov hlau lossis cov hlau tsis muaj hlau, thiab txawm tias cov yas, roj hmab, quartz, ceramics, thiab lwm yam.
Classification ntawm Vacuum Ion Txheej
Muaj ntau yam kev sib txuas ntawm ionization thiab excitation txoj kev sib txawv evaporation qhov chaw thiab atoms, ua rau muaj ntau yam evaporation qhov chaw ion plating txoj kev. Cov txheej txheem muaj xws li sputtering ion plating thiab evaporation ion plating raws li qhov tau txais ntawm daim nyias nyias.
1. Sputtering hom ion plating
Los ntawm kev siv lub zog siab ions los ua kom lub ntsej muag ntawm cov khoom siv membrane, cov khoom hlau yog tsim. Cov hlau hais ionize rau hauv cov hlau ions hauv qhov chaw tso pa tawm, thiab lawv ncav cuag lub substrate nyob rau hauv qhov tsis zoo ntawm kev tsis zoo rau kev tso nyiaj thiab tsim ib zaj duab xis.
Evaporative ion plating
Cua sov cov khoom siv los ntawm ntau txoj kev cua sov kom evaporate thiab tsim hlau vapor, uas yog tom qab ntawd nkag mus rau hauv cov pa paug qhov chaw zoo siab rau ntau txoj hauv kev los ionize rau hauv cov hlau ions. Cov ions no ncav cuag lub substrate nyob rau hauv tsis zoo bias thiab tso rau hauv ib zaj duab xis.
Ntawm lawv, evaporative ion plating tuaj yeem muab faib ua DC ob-theem ion plating, hollow cathode ion plating, kub hlau arc ion plating, thiab cathode arc ion plating raws li cov qauv sib txawv. DC theem nrab ion plating yog lub teeb ci ruaj khov; Hollow cathode ion plating thiab kub xaim arc ion plating yog ob qho tib si thermal arc tawm, thiab yog vim li cas rau tiam ntawm electrons tau yooj yim summarized raws li lub thermal emission ntawm electrons sab nraum lub nucleus vim cov cua sov ntawm cov ntaub ntawv hlau mus rau high kub; Cov paug tawm ntawm cathodic arc ion plating yog txawv los ntawm hom yav dhau los ntawm ion plating, thiab nws siv txias arc paug.
(1) Hollow cathode ion plating (HCD)
Siv hollow kub cathode paug los tsim cov plasma electron beam. Cov yam ntxwv ntawm hollow cathode ion plating: ① HCD hollow cathode phom yog ob qho tib si lub tshav kub rau cov khoom siv membrane gasification thiab ionization qhov chaw rau evaporated hais, thiab txoj kev ionization yog siv cov hluav taws xob qis hluav taws xob sib tsoo; ② Siv lub zog acceleration xws li 0V mus rau ntau pua volts, ionization thiab ion acceleration ua hauj lwm ntawm nws tus kheej Yuav ua tau reactive ion plating zoo; ④ Qhov kub ntawm lub substrate yog me me, thiab lub substrate tseem yuav tsum tau rhuab thaum txheej txheej; ⑤ High ionization efficiency, loj electron beam chaw, thiab tuaj yeem tso rau hauv ntau yam yeeb yaj kiab.
(2) Cathodic arc ion plating
Cathodic arc ion plating yog qhov tseem ceeb ntawm cov txheej txheem ion txheej txheem, uas tau txais qhov txias arc tawm thiab muaj qhov siab tshaj plaws ionization tus nqi ntawm ntau PVD txheej thev naus laus zis.
